Surface Mounting Instructions

Rev. V6

Application Note

M538

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

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1

Surface mount board layout is a critical portion of the total design. The footprint must be the correct size to

ensure proper solder connection interface between the board and the package. With the correct pad geometry,

the package will self-align when subjected to a solder reflow process and will also allow for just enough excess

surface area for adequate solder filleting. The following recommended footprints are suggested guidelines only

and may require ground plane modifications for electrical and/or thermal considerations. When an increase in

ground plane size is necessary, solder mask over bare copper (SMOBC) should be utilized to contain solder and

eliminate alignment problems during solder reflow. Electrical and/or thermal considerations may also require the

board to contain plated vias located under the surface mount package.

When this is necessary, the

recommended via diameter is 0.3mm with a pitch of 1.0mm. To prevent solder wicking inside the via during

reflow, solder mask pads are recommended over all vias located under the package. The solder mask diameter

should be 100 microns larger than the via diameter. Blind or filled vias also work well as an alternative to solder

mask to further enhance thermal conduction.

Footprint Guidelines

Package Style Footprints