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M542 Datasheet(PDF) 3 Page - M/A-COM Technology Solutions, Inc.

Part # M542
Description  Electrical Characterization of Packages for Use with GaAs MMIC Amplifiers
PDF  4 Pages
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Manufacturer  MA-COM [M/A-COM Technology Solutions, Inc.]
Direct Link  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

M542 Datasheet(HTML) 3 Page - M/A-COM Technology Solutions, Inc.

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Electrical Characterization of Packages for Use with GaAs
MMIC Amplifiers
Rev. V4
Application Note
M542
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.4155721
• China Tel: +86.21.2407.1588
3
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Experimental Results
The feedthrough walls of each package listed in
Table 1 have been tested and modeled.
This
feedthrough data alone largely indicates the useful
frequency range of each package. Figure 5 shows
the frequency response for the feedthrough of the
8-lead ceramic flatpack. This package, previously
thought to be useful only at lower frequencies,
demonstrates excellent performance well into X-
band before resonating. Based on this result, we
assembled our 2-8 GHz GaAs MMIC amplifier into
this package. The performance of this packaged
amplifier, part number MAAM28000-A1, is shown
in Figure 6.
Figure 5. Feedthrough Frequency
Response
Figure 6. MAAM28000-A1 Performance
Using the de-embedded feedthrough data, Y-
parameter extraction followed by a constrained op-
timization was performed to derive the feedthrough
model shown in Figure 7.
Figure 8 shows the measured versus modeled in-
sertion loss and input return loss for this package
feedthrough. The model simulates the feedthrough
performance closely over the useful frequency
range of the package.
Figure 7. Feedthrough Model
Figure 8. Measured vs. Modeled
Performance
Coupling effects between package ports were also
measured and modeled. A Y-parameter extraction
showed that the coupling could be attributed to
equivalent capacitance values. In the case of the
8-lead ceramic flatpack, coupling between adjacent
ports along one side of the flatpack can be repre-
sented by a 0.03 pF capacitance. Between alter-
nate ports along the same side, the coupling ca-
pacitance is nominally 0.003 pF.
Coupling be-
tween internally terminated ports on opposite sides
of the flatpack was modeled with a 0.0007 pF ca-
pacitor.
This coupling model accurately predicts
the measured input to output isolation, as illus-
trated in Figure 9, over the package’s useful fre-
quency range.
-20
-15
-10
-5
0
5
10
15
20
0246
8
10
Gain
S11
S22
Frequency (GHz)



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