MAX14842 datasheet(2/13 Pages) MAXIM

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6-Channel, Digital Ground-Level Translator

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

VDDA to GNDA ........................................................-0.3V to +6V

VDDB to GNDB ........................................................-0.3V to +6V

GNDB to GNDA.....................................................-0.3V to +80V

INA1, INA2 to GNDA.............................. -0.3V to (VDDA + 0.3V)

INB1, INB2 to GNDB.............................. -0.3V to (VDDB + 0.3V)

OUTA1, OUTA2 to GNDA ...................... -0.3V to (VDDA + 0.3V)

OUTB1, OUTB2 to GNDB ...................... -0.3V to (VDDB + 0.3V)

I/OA1, I/OA2 to GNDA ............................................-0.3V to +6V

I/OB1, I/OB2 to GNDB ............................................-0.3V to +6V

Common-Mode Transients (i.e., Transients

Between GNDA and GNDB)......................................... 10V/Fs

Short-Circuit Duration (OUTA1, OUTA2 to GNDA;

OUTB1, OUTB2 to GNDB).....................................Continuous

Continuous Power Dissipation (TA = +70NC)

TQFN (derate 25mW/NC above +70NC) .....................2000mW

Operating Temperature Range........................ -40NC to +125NC

Junction Temperature .....................................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

ELECTRICAL CHARACTERISTICS

(VDDA - VGNDA = +3.0V to +5.5V, VDDB - VGNDB = +3.0V to +5.5V, VGNDB - VGNDA = 0 to +72V, TA = -40NC to +125NC, unless oth-

erwise noted. Typical values are at VDDA - VGNDA = +3.3V, VDDB - VGNDB = +3.3V, VGNDB - VGNDA = +50V, TA = +25NC.) (Note 2)

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

TQFN

Junction-to-Ambient Thermal Characteristics (

qJA) ....40°C/W

Junction-to-Case Thermal Characteristics (

qJC) ...........6°C/W

PACKAGE THERMAL CHARACTERISTICS (Note 1)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNIT

DC CHARACTERISTICS

Supply Voltage

VDDA

Relative to GNDA

3.0

5.5

VDDB

Relative to GNDB

3.0

5.5

Supply Current

IDDA

IDDB

VDDA - VGNDA = +5.5V; VDDB - VGNDB =

+5.5V; VGNDB - VGNDA = +70V; all inputs

at VGNDA, VGNDB, or +5.5V; no load

7.5

Voltage Between GNDB and

GNDA

VGG

VGNDB - VGNDA

Side B Leakage Current

Undervoltage-Lockout Threshold

VUVLO

VDDA - VGNDA, VDDB - VGNDB

Undervoltage-Lockout Hysteresis VUVLOHYS VDDA - VGNDA, VDDB - VGNDB

0.1

LOGIC INPUTS AND OUTPUTS

Input Logic Threshold Voltage

VIT

I/OA1, I/OA2, relative to GNDA

0.5

0.7

Input Logic-High Voltage

VIH

INA1, INA2, relative to GNDA

0.7 x

VDDA

INB1, INB2, relative to GNDB

0.7 x

VDDB

I/OA1, I/OA2, relative to GNDA

0.7

I/OB1, I/OB2, relative to GNDB

0.7 x

VDDB

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