AD586 datasheet(48/48 Pages) AD

48 / 48 page

AD5735

Data Sheet

Rev. B | Page 48 of 48

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4

0.25 MIN

TOP VIEW

8.75

BSC SQ

9.00

BSC SQ

0.50

0.40

0.30

0.50

BSC

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

7.50

REF

0.05 MAX

0.02 NOM

0.60 MAX

0.60

MAX

EXPOSED PAD

(BOTTOM VIEW)

SEATING

PLANE

PIN 1

INDICATOR

7.25

7.10 SQ

6.95

PIN 1

INDICATOR

0.30

0.23

0.18

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 86. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

9 mm × 9 mm Body, Very Thin Quad

(CP-64-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Resolution (Bits)

Temperature Range

Package Description

Package Option

AD5735ACPZ

−40°C to +105°C

64-Lead LFCSP_VQ

CP-64-3

AD5735ACPZ-REEL7

−40°C to +105°C

64-Lead LFCSP_VQ

CP-64-3

Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D09961-0-5/12(B)

AD586 Datasheet(PDF) 48 Page - Analog Devices

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