AD586 datasheet(11/48 Pages) AD

11 / 48 page

Data Sheet

AD5735

Rev. B | Page 11 of 48

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted. Transient currents of up to

100 mA do not cause SCR latch-up.

Table 4.

Parameter

Rating

AVDD, VBOOST_x to AGND, DGND

−0.3 V to +33 V

AVSS to AGND, DGND

+0.3 V to −28 V

AVDD to AVSS

−0.3 V to +60 V

AVCC to AGND

−0.3 V to +7 V

DVDD to DGND

−0.3 V to +7 V

Digital Inputs to DGND

−0.3 V to DVDD + 0.3 V or +7 V

(whichever is less)

Digital Outputs to DGND

−0.3 V to DVDD + 0.3 V or +7 V

(whichever is less)

REFIN, REFOUT to AGND

−0.3 V to AVDD + 0.3 V or +7 V

(whichever is less)

VOUT_x to AGND

AVSS to VBOOST_x or 33 V if using

the dc-to-dc converter

+VSENSE_x, −VSENSE_x to AGND

AVSS to VBOOST_x or 33 V if using

the dc-to-dc converter

IOUT_x to AGND

AVSS to VBOOST_x or 33 V if using

the dc-to-dc converter

SWx to AGND

−0.3 V to +33 V

AGND, GNDSWx to DGND

−0.3 V to +0.3 V

Operating Temperature Range (TA)

Industrial1

−40°C to +105°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature (TJ max)

125°C

Power Dissipation

(TJ max − TA)/θJA

Lead Temperature

JEDEC industry standard

Soldering

J-STD-020

Power dissipated on chip must be derated to keep the junction temperature

below 125°C.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

Junction-to-air thermal resistance (θJA) is specified for a JEDEC

4-layer test board.

Table 5. Thermal Resistance

Package Type

θJA

Unit

64-Lead LFCSP (CP-64-3)

°C/W

ESD CAUTION

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