AD9634 datasheet(9/32 Pages) AD

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AD9634

Rev. 0 | Page 9 of 32

ABSOLUTE MAXIMUM RATINGS

THERMAL CHARACTERISTICS

Table 6.

Parameter

Rating

Electrical

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to AGND

−0.3 V to +2.0 V

VIN+, VIN− to AGND

−0.3 V to AVDD + 0.2 V

CLK+, CLK− to AGND

−0.3 V to AVDD + 0.2V

VCM to AGND

−0.3 V to AVDD + 0.2 V

CSB to AGND

−0.3 V to DRVDD + 0.3 V

SCLK to AGND

−0.3 V to DRVDD + 0.3 V

SDIO to AGND

−0.3 V to DRVDD + 0.3 V

D0±/D1± through D10±/D11±

to AGND

−0.3 V to DRVDD + 0.3 V

DCO+/DCO− to AGND

−0.3 V to DRVDD + 0.3 V

OR+/OR− to AGND

−0.3 V to DRVDD + 0.3 V

Environmental

Operating Temperature Range

(Ambient)

−40°C to +85°C

Maximum Junction Temperature

Under Bias

150°C

Storage Temperature Range

(Ambient)

−65°C to +125°C

The exposed paddle must be soldered to the ground plane for the

LFCSP package. Soldering the exposed paddle to the customer

board increases the reliability of the solder joints, maximizing

the thermal capability of the package.

Table 7. Thermal Resistance

Package

Type

Airflow

Velocity

(m/sec)

θJA1,2

θJC1,3

θJB1,4

Unit

37.1

3.1

20.7

°C/W

1.0

32.4

°C/W

32-Lead LFCSP

5 mm × 5 mm

(CP-32-12)

2.0

29.1

°C/W

1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-Std 883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

Typical θJA is specified for a 4-layer PCB with solid ground plane.

As shown in Table 7, airflow increases heat dissipation, which

reduces θJA. In addition, metal in direct contact with the package

leads from metal traces, through holes, ground, and power

planes reduces the θJA.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

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