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AS1154

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

Electrical Parameters

VCC to GND

-0.3

5.0

V

INx to GND

-0.3

Vcc + 0.3

V

OUTx+, OUTx- to GND

-0.3

5.0

V

Short Circuit Duration (OUTx+, OUTx-)

Continuous

Electrostatic Discharge

Electrostatic Discharge HBM

+/- 4

kV

Norm: MIL 883 E method 3015, INx, OUTx+, OUTx-

Continous Power Dissipation

755

mW

1. Depending on actual PCB layout and PCB used.

Continous Power Dissipation Derating Factor

9.4

mW / °C

Temperature Ranges and Storage Conditions

Junction Temperature

+150

ºC

Storage Temperature Range

-55

+125

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020“Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State Surface

Mount Devices”.

The lead finish for Pb-free leaded packages is matte tin

(100% Sn).

Humidity non-condensing

5

85

%

Moisture Sensitive Level

1

Represents a max. floor life time of unlimited