LT3008 Series

17

3008fc

TYPICAL APPLICATIONS

IN

SHDN

3.3V

3009 TA02

OUT

1μF

2.2μF

SENSE

GND

LT3008-3.3

NO PROTECTION

DIODES NEEDED!

12V

LOAD:

SYSTEM MONITOR,

VOLATILE MEMORY, ETC.

IN

SHDN

5V

3008 TA03

OUT

FAULT

1μF

SUPERCAP

2.2μF

SENSE

PWR

TO

MONITORING

CENTER

SENSE

GND

GND

LT3008-5

LINE POWER

12V TO 15V

LINE

INTERRUPT

DETECT

Keep-Alive Power Supply

Last-Gasp Circuit

PACKAGE DESCRIPTION

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

2.00

±0.10

(4 SIDES)

0.75

±0.05

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

0.00 – 0.05

0.25

±0.05

1.42

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.61

±0.05

(2 SIDES)

1.15

±0.05

0.70

±0.05

2.55

±0.05

PACKAGE

OUTLINE

0.50 BSC

0.40

±0.10

BOTTOM VIEW—EXPOSED PAD

0.56

±0.05

(2 SIDES)

R = 0.125

TYP

R = 0.05

TYP

1.37

±0.05

(2 SIDES)

1

3

6

4

(DC6) DFN REV B 1309

0.25

±0.05

0.50 BSC

PIN 1 NOTCH

R = 0.20 OR

0.25

× 45°

CHAMFER

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

DC6 Package

6-Lead Plastic DFN (2mm

× 2mm)

(Reference LTC DWG # 05-08-1703 Rev B)