ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 52

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Suggested Pad Layout

© Diodes Incorporated

SUGGESTED PAD LAYOUT

Based on IPC-7351A

X1-DFN1006-2 / X2-DFN1006-2 / MiniMELF / MELF / SOD323 / SOD123 / SOD523 / SMA / SMB / SMC

Dimensions

X1-DFN1006-2 /

X2-DFN1006-2

MiniMELF

MELF

SOD123

SOD323

SOD523

SMA

SMB

SMC

Z

1.1

4.7

6.3

4.9

3.75

2.3

6.5

6.8

9.4

G

0.3

2.1

3.3

2.5

1.05

1.1

1.5

1.8

4.4

X

0.7

1.7

2.7

0.7

0.65

0.8

1.7

2.3

3.3

Y

0.4

1.3

1.5

1.2

1.35

0.6

2.5

2.5

2.5

C

0.7

3.5

4.8

3.7

2.40

1.7

4.0

4.3

6.8

X3-DFN0603-2

X2-DFN0806-3

Dimensions Value (in mm)

C

0.355

X

0.230

Y

0.300

Z

0.610

Dimensions

Value

(in mm)

C

0.350

X

0.200

X1

0.450

X2

0.550

Y

0.375

Y1

0.475

Y2

1.000

Z

X

C

G

Y

Z

Y (2x)

X (2x)

C

X1

X2

Y2

Y1

Y (2x)

X (2x)

C