MK40DX128VMB7 datasheet(21/72 Pages) FREESCALE

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5.4.1 Thermal operating requirements

Table 10. Thermal operating requirements

Symbol

Description

Min.

Max.

Unit

Die junction temperature

–40

125

°C

Ambient temperature

–40

105

°C

5.4.2 Thermal attributes

Board type

Symbol

Description

81 MAPBGA

80 LQFP

Unit

Notes

Single-layer

(1s)

RθJA

Thermal

resistance,

junction to

ambient (natural

convection)

°C/W

1, 2

Four-layer

(2s2p)

RθJA

Thermal

resistance,

junction to

ambient (natural

convection)

°C/W

1, 3

Single-layer

(1s)

RθJMA

Thermal

resistance,

junction to

ambient (200 ft./

min. air speed)

°C/W

1,3

Four-layer

(2s2p)

RθJMA

Thermal

resistance,

junction to

ambient (200 ft./

min. air speed)

°C/W

1,3

—

RθJB

Thermal

resistance,

junction to

board

°C/W

—

RθJC

Thermal

resistance,

junction to case

°C/W

—

ΨJT

Thermal

characterization

parameter,

junction to

package top

outside center

(natural

convection)

°C/W

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

General

K40 Sub-Family Data Sheet, Rev. 2, 4/2012.

Freescale Semiconductor, Inc.

MK40DX128VMB7 Datasheet(PDF) 21 Page - Freescale Semiconductor, Inc

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