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33984 Datasheet(PDF) 35 Page - Freescale Semiconductor, Inc |
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33984 Datasheet(HTML) 35 Page - Freescale Semiconductor, Inc |
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35 / 38 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 35 33984 ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 3.0) Figure 2. Thermal Test Board Device on Thermal Test Board RθJA is the thermal resistance between die junction and ambient air. This device is a dual die package. Index m indicates the die that is heated. Index n refers to the number of the die where the junction temperature is sensed. HS1 HS0 16 15 VPWR 14 GND 13 16-Pin PQFN 0.90 mm Pitch 12.0 mm x 12.0 mm Body 33984 Pin Connections A A 1 11 10 9 8 7 6 5 4 3 2 12 Transparent Top View A Material: Single layer printed circuit board FR4, 1.6 mm thickness Cu traces, 0.07 mm thickness Outline: 80 mm x 100 mm board area, including edge connector for thermal testing Area A: Cu heat-spreading areas on board surface Ambient Conditions: Natural convection, still air Table 2. Thermal Resistance Performance Thermal Resistance Area A (mm2) 1 = Power Chip, 2 = Logic Chip ( °C/W) m = 1, n = 1 m = 1, n = 2 m = 2, n = 1 m = 2, n = 2 RθJAmn 055 42 74 300 41 31 66 600 38 29 64 |
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