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TPS54821 Datasheet(PDF) 17 Page - Texas Instruments |
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TPS54821 Datasheet(HTML) 17 Page - Texas Instruments |
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17 / 37 page ![]() VSENSE COMP VOUT R1 R3 C1 C2 R2 Coea Roea gm 1300 mA/V 0.6 V Power Stage PH RESR CO RL b a c 21 A/V TPS54821 www.ti.com SLVSB14 – OCTOBER 2011 The low-side MOSFET may also sink current from the load. If the low-side sinking current limit is exceeded the low-side MOSFET is turned off immediately for the rest of that clock cycle. In this scenario both MOSFETs are off until the start of the next cycle. Furthermore, if an output overload condition (as measured by the COMP pin voltage) has lasted for more than the hiccup wait time which is programmed for 512 switching cycles, the device will shut down itself and restart after the hiccup time of 16384 cycles. The hiccup mode helps to reduce the device power dissipation under severe overcurrent conditions. Thermal Shutdown The internal thermal shutdown circuitry forces the device to stop switching if the junction temperature exceeds 175 °C typically. Once the junction temperature drops below 165°C typically, the internal thermal hiccup timer will start to count. The device reinitiates the power up sequence after the built-in thermal shutdown hiccup time (16384 cycles) is over. Small Signal Model for Loop Response Figure 25 shows an equivalent model for the device control loop which can be modeled in a circuit simulation program to check frequency response and transient responses. The error amplifier is a transconductance amplifier with a gm of 1300 μA/V. The error amplifier can be modeled using an ideal voltage controlled current source. The resistor Roea (3.07 M Ω) and capacitor Coea (20.7 pF) model the open loop gain and frequency response of the error amplifier. The 1-mV ac voltage source between the nodes a and b effectively breaks the control loop for the frequency response measurements. Plotting a/c and c/b show the small signal responses of the power stage and frequency compensation respectively. Plotting a/b shows the small signal response of the overall loop. The dynamic loop response can be checked by replacing the RL with a current source with the appropriate load step amplitude and step rate in a time domain analysis. Figure 25. Small Signal Model for Loop Response Simple Small Signal Model for Peak Current Mode Control Figure 26 is a simple small signal model that can be used to understand how to design the frequency compensation. The device power stage can be approximated to a voltage controlled current source (duty cycle modulator) supplying current to the output capacitor and load resistor. The control to output transfer function is shown in Equation 10 and consists of a dc gain, one dominant pole and one ESR zero. The quotient of the change in switch current and the change in COMP pin voltage (node c in Figure 25) is the power stage transconductance (gmps) which is 21 A/V for the device. The DC gain of the power stage is the product of gmps and the load resistance, R L, as shown in Equation 11 with resistive loads. As the load current increases, the DC gain decreases. This variation with load may seem problematic at first glance, but fortunately the dominant pole moves with load current (see Equation 12). The combined effect is highlighted by the dashed line in Figure 27. As the load current decreases, the gain increases and the pole frequency lowers, keeping the 0-dB crossover frequency the same for the varying load conditions which makes it easier to design the frequency compensation. Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 17 Product Folder Link(s) :TPS54821 |
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