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4

BL8519

DEMO BOARD BOM

No.

Reference

Type

Specification

Note

1

C1

Capacitor

MLCC 10uF; SMD 0805

2

C2

Capacitor

MLCC 10uF; SMD 0805

3

D1

Diode

SS34; 40V, 3A; SMD

4

L1

Inductor

10uH; 3A; SMD, Shielding

5

IC1

IC

BL8519; SMD SOP-8

6

R1

Resistor

SMD 0805; 30K；1%

7

R2

Resistor

SMD 0805; 10K；1%

LAYOUT CONSIDERATION

Careful PCB layout is critical to achieving low switching losses and clean, stable operation.

The switching power stage requires particular attention. If possible, mount all the power

components on one side of the board, with their ground terminals as close to one another as

possible.

Keep the high-current paths short, especially the distance between Cin and the Vin (GND)

terminals. It is essential for stable, jitter-free operation, showing as the following figure. The

ESR of Cin should be smaller enough and the capacitance of Cin should be large enough for

filtering the switching noise across power path, a 10uF ceramic capacitor is recommended.

Keep the trace connecting to SW terminal wide enough for heat dissipation, if possible, it is

better to place some vias connected to the bottom copper for enhancement.

Route high-speed switching nodes, for example SW terminal, away from sensitive analog

trace (eg. FB terminal).