EMIF06-1002F2

Package information

Doc ID 14730 Rev 2

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Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 9.

Package dimensions

Note:

More packing information is available in the application notes:

AN1235: "Flip Chip: Package description and recommendations for use"

AN1751: “EMI filters: Recommendations and measurements”

Figure 10.

Footprint

Figure 11.

Marking

1.79 mm ± 50 µm

315 µm ± 50

500

µm

± 1

0

650 µm ± 65

Copper pad Diameter:

250 µm recommended , 300 µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 300 µm copper pad diameter

x

y

z

w

x

w

Dot, ST logo

xx = marking

yww = datecode

(y = year

ww = week)

z = manufacturing location

E