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AL5812 Datasheet(PDF) 3 Page - Diodes Incorporated |
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AL5812 Datasheet(HTML) 3 Page - Diodes Incorporated |
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3 / 12 page ![]() AL5812 Document number: DS35616 Rev. 1 - 2 3 of 12 www.diodes.com September 2012 © Diodes Incorporated AL5812 Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol Parameters Ratings Unit VCC Supply Voltage Relative to GND Pin (Note 4) -0.3 to +66 V VLED LED Pin Voltage Relative to GND Pin (Note 4) -0.3 to +66 V VRSET RSET Pin Voltage Relative to GND -0.3 to +6 V ILED LED Pin Current Sink Current Range 165 mA ESD HBM Human Body Model ESD Protection 1 kV ESD CDM Charged Device Model ESD Protection 1.2 kV TJ Operating Junction Temperature -40 to +150 °C TST Storage Temperature -55 to +150 °C Note: 4.VCC pin can be greater or smaller than VLED; neither should go below GND. Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices. Package Thermal Data Package θ JC Thermal Resistance Junction-to-Case (Note 7) θ JA Thermal Resistance Junction-to-Ambient (Note 7) PDIS TA = +25°C, TJ = +125°C (Note 7) MSOP-8EP 39 90°C/W (Note 5) 1.1W U-DFN3030-6 14 69°C/W (Note 6) 1.47W Notes: 5. Test condition for MSOP-8EP: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed. 6. Test condition for U-DFN3030-6: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed 7. Dominant conduction path via exposed pad. Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max Unit VCC Supply Voltage Range Relative to GND Pin 3.5 60 V VLED LED Pin Output Voltage Range Relative to GND Pin 1 60 ILED LED Pin Current (Notes 8 & 9) 10 150 mA TA Operating Ambient Temperature Range -40 +125 °C Notes: 8. For improved accuracy LED current should be greater than 60mA. 9. Maximum LED current is also limited by ambient temperature and power dissipation such that junction temperature should be kept less than or equal to +125°C. |
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