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AL5812 Datasheet(PDF) 3 Page - Diodes Incorporated

Part # AL5812
Description  60V, 150mA ADJUSTABLE LINEAR LED DRIVER
PDF  12 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

AL5812 Datasheet(HTML) 3 Page - Diodes Incorporated

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AL5812
Document number: DS35616 Rev. 1 - 2
3 of 12
www.diodes.com
September 2012
© Diodes Incorporated
AL5812
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
Parameters
Ratings
Unit
VCC
Supply Voltage Relative to GND Pin (Note 4)
-0.3 to +66
V
VLED
LED Pin Voltage Relative to GND Pin (Note 4)
-0.3 to +66
V
VRSET
RSET Pin Voltage Relative to GND
-0.3 to +6
V
ILED
LED Pin Current Sink Current Range
165
mA
ESD HBM
Human Body Model ESD Protection
1
kV
ESD CDM
Charged Device Model ESD Protection
1.2
kV
TJ
Operating Junction Temperature
-40 to +150
°C
TST
Storage Temperature
-55 to +150
°C
Note:
4.VCC pin can be greater or smaller than VLED; neither should go below GND.
Caution:
Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may
be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when
handling and transporting these devices.
Package Thermal Data
Package
θ
JC
Thermal Resistance
Junction-to-Case
(Note 7)
θ
JA
Thermal Resistance
Junction-to-Ambient
(Note 7)
PDIS
TA = +25°C, TJ = +125°C
(Note 7)
MSOP-8EP
39
90°C/W (Note 5)
1.1W
U-DFN3030-6
14
69°C/W (Note 6)
1.47W
Notes:
5. Test condition for MSOP-8EP: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and
thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.
6. Test condition for U-DFN3030-6: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and
thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed
7. Dominant conduction path via exposed pad.
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
Min
Max
Unit
VCC
Supply Voltage Range Relative to GND Pin
3.5
60
V
VLED
LED Pin Output Voltage Range Relative to GND Pin
1
60
ILED
LED Pin Current (Notes 8 & 9)
10
150
mA
TA
Operating Ambient Temperature Range
-40
+125
°C
Notes:
8. For improved accuracy LED current should be greater than 60mA.
9. Maximum LED current is also limited by ambient temperature and power dissipation such that junction temperature should be kept less than or equal
to +125°C.



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