RT9718 datasheet(4/10 Pages) RICHTEK

4 / 10 page

RT9718

DS9718-02 May 2011

www.richtek.com

Note 1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.

These are stress ratings only, and functional operation of the device at these or any other conditions beyond those

indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

Note 2.

θJA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board

of JEDEC 51-3 thermal measurement standard. The case position of

θJC is on the exposed pad of the packages.

Note 3. Devices are ESD sensitive. Handling precaution is recommended.

Note 4. The device is not guaranteed to function outside its operating conditions.

Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

Over Current Protection

IOCP

As RILIM = 25k

0.93

1.07

Over Current Protection Blanking

Time

TOC

180

μs

Over Current Recover Delay

Threshold Rising

4.3

4.35

4.4

Battery Over Voltage Protection

Hysteresis

Battery OVP Falling Threshold

VBOVP

4.225

Battery OVP Blanking Time

180

μs

Battery OVP Recover Delay

VB Pin Leakage Current

TVBOV

VVB = 4.4V

Rising

140

°C

OTP Threshold

Hysteresis

°C

OTP Recover Delay

Soft-Start Time

TSD

Logic

Logic-High VIH

1.5

EN Threshold Voltage

Logic-Low

VIL

0.4

EN Internal Pull Down Resistor

100

200

400

WRN Output Logic Low

Sink 5mA

0.35

0.8

WRN Output Logic High Leakage

Current

μA

Power MOSFET

On Resistance

RON

IOUT = 500mA, 4.3V < VIN < 6.5V

200

300

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