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RT9052 Datasheet(PDF) 8 Page - Richtek Technology Corporation |
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RT9052 Datasheet(HTML) 8 Page - Richtek Technology Corporation |
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8 / 9 page ![]() RT9052 8 DS9052-01 April 2011 www.richtek.com 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0 25 50 75 100 125 Ambient Temperature (°C) Layout Consideration There are three critical layout considerations. The current setting resistor should be located as close as possible to the RT9052 to avoid inducing any noise. The input capacitor have to put at near the IC for improved performance. The pass element operating under high power situation may raise the junction temperature above the package thermal resistance limit. (copper area can be added to improve power dissipation.) Figure 1. Derating Curve for RT9052 Package Single-Layer PCB DIM GND ISET VCC DRI 4 2 3 5 6 VCC CIN 5V GND DRI RB RISET VLED WLED R1 Place CIN near the IC for improved performance The GND plane should be connected to a strong ground plane for heat sinking and noise protection. ISET node copper area should be minimized and kept far away from noise sources FAULT Figure 2. PCB Layout Guide |
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