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RT9137 Datasheet(PDF) 13 Page - Richtek Technology Corporation |
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RT9137 Datasheet(HTML) 13 Page - Richtek Technology Corporation |
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13 / 21 page ![]() RT9137/8/9 13 DS9137/8/9-01 April 2011 www.richtek.com Layout Considerations PCB layout is very important for designing power circuits. The following layout guidelines should be strictly followed for best performance of the RT9137/8/9. Place the components as close to the IC as possible. The traces should be wide and short, especially for the high current loop. Connect a 0.1 μF capacitor from VIN+ to ground and place it as close to the IC as possible for better performance. A series resistance may be needed at the output for some applications. The exposed pad of the chip should be connected to a strong ground or VS- plane for maximum thermal consideration. 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 2.20 0 255075 100 125 Ambient Temperature (°C) Four-Layer PCB TSSOP-14 (Exposed Pad) WQFN-16L 4x4 WDFN-10L 3x3 MSOP-10 TSSOP-14 MSOP-8 MSOP-8 TSOT-23-5 Figure 1. Derating Curves for the RT9137/8/9 Packages |
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