HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : IC200907

Issued Date : 2009.04.03

Revised Date :2009.10.29

Page No. : 6/7

H277

HSMC Product Specification

SIP-4L Dimension

DIM

Min.

Max.

A

5.12

5.32

B

4.10

4.30

C

3.55

3.75

D

0.43

0.49

E

0.35

0.41

F

1.24

1.30

G

3.78

3.84

H

1.32

1.52

I

1.45

1.65

J

0.93

1.13

K

13.00

15.50

L

a1

3

o

5

o

a2

5

o

7

o

*: Typical, Unit: mm

A

B

C

a1

a2

D

E

F

G

H

Marking Site

a1

J

I

K

a2

E

12

3

4

L

Marking:

Note: Green label is used for Pb-free packing

Pin Style: 1.VCC 2.Vout1 3.Vout2 4.GND

Hall Sensor Location:

2.0 0 m m

1.25 m m

To p

Vie w

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

4-Lead SIP-4L

Plastic Package

HSMC Package Code: AD

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of AVANTIC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office:

• Head Office (Hi-Sincerity Microelectronics Corp.): 5/F., Golden Harvest Building 15 Wang Chiu Road, Kowloon Bay, Hong Kong

Tel: +852-2755-7162 Fax: +852-2755- 7795

AVANTICS : Shanghai Address: No.399, Cai Lum Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai 201210, China

Tel: +86(21) 61637118

Fax: +86(21)61637006