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AD598 Datasheet(PDF) 9 Page - Analog Devices |
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AD598 Datasheet(HTML) 9 Page - Analog Devices |
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9 / 16 page ![]() AD598 REV. A –9– Figure 15. Gain and Phase Characteristics vs. Frequency (0 kHz–10 kHz) 1000 100 10 1 0.1 0.01 0.1 1 10 C2, C3, C4; C2 = C3 = C4 – µF 2.5kHz, C SHUNT = 0nF 2.5kHz, C SHUNT = 1nF 2.5kHz, C SHUNT =10nF Figure 16. Output Voltage Ripple vs. Filter Capacitance 1000 100 10 1 0.1 0.001 0.01 0.1 110 C2, C3, C4; C2 = C3 = C4 – µF 10kHz , C SHUNT = 0nF 10kHz , C SHUNT = 1nF 10kHz , C SHUNT = 10nF Figure 17. Output Voltage Ripple vs. Filter Capacitance Determining LVDT Sensitivity LVDT sensitivity can be determined by measuring the LVDT secondary voltages as a function of primary drive and core posi- tion, and performing a simple computation. Energize the LVDT at its recommended primary drive level, VPRI (3 V rms for the E100). Set the core to midpoint where VA = VB. Set the core displacement to its mechanical full-scale position and measure secondary voltages VA and VB. Sensitivity = VA(at Full Scale )– VB (at Full Scale ) VPRI × d From Figure 18, Sensitivity = 1.71 – 0.99 3 × 100 mils = 2.4 mV/V/mil d = –100 mils d = 0 A V VB 1.71V rms 0.99V rms 100 mils + d = VSEC WHEN VPRI = 3V rms Figure 18. LVDT Secondary Voltage vs. Core Displacement Thermal Shutdown and Loading Considerations The AD598 is protected by a thermal overload circuit. If the die temperature reaches 165 °C, the sine wave excitation amplitude gradually reduces, thereby lowering the internal power dissipa- tion and temperature. Due to the ratiometric operation of the decoder circuit, only small errors result from the reduction of the excitation ampli- tude. Under these conditions the signal-processing section of the AD598 continues to meet its output specifications. The thermal load depends upon the voltage and current deliv- ered to the load as well as the power supply potentials. An LVDT Primary will present an inductive load to the sine wave excitation. The phase angle between the excitation voltage and current must also be considered, further complicating thermal calculations. |
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