AD7822 datasheet(4/20 Pages) AD

4 / 20 page

AD7822/AD7825/AD7829

–4–

REV. B

Parameter 5 V

10%

3 V

10%

Unit

Conditions/Comments

420

ns max

Conversion Time.

ns min

Minimum CONVST Pulsewidth.

ns min

Minimum time between the rising edge of RD and next falling edge of convert start.

110

ns max

EOC Pulsewidth.

ns min

ns max

RD rising edge to EOC pulse high.

ns min

CS to RD setup time.

ns min

CS to RD hold time.

ns min

Minimum RD Pulsewidth.

ns max

Data access time after RD low.

t10

ns min

Bus relinquish time after RD high.

ns max

t11

ns min

Address setup time before falling edge of RD.

t12

ns min

Address hold time after falling edge of RD.

t13

200

ns min

Minimum time between new channel selection and convert start.

tPOWER UP

µs typ

Power-up time from rising edge of CONVST using on-chip reference.

tPOWER UP

µs max

Power-up time from rising edge of CONVST using external 2.5 V reference.

NOTES

1Sample tested to ensure compliance.

2See Figures 20, 21, and 22.

3Measured with the load circuit of Figure 1 and defined as the time required for an output to cross 0.8 V or 2.4 V with V

DD = 5 V

± 10%, and time required for

an output to cross 0.4 V or 2.0 V with VDD = 3 V

± 10%.

4Derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then extrapolated back

to remove the effects of charging or discharging the 50 pF capacitor. This means that the time, t 10, quoted in the timing characteristics is the true bus relinquish time

of the part and as such is independent of external bus loading capacitances.

ABSOLUTE MAXIMUM RATINGS

(TA = 25

°C unless otherwise noted)

VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Analog Input Voltage to AGND

VIN1 to VIN8 . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V

Reference Input Voltage to AGND . . . –0.3 V to VDD + 0.3 V

VMID Input Voltage to AGND . . . . . . . –0.3 V to VDD + 0.3 V

Digital Input Voltage to DGND . . . . . –0.3 V to VDD + 0.3 V

Digital Output Voltage to DGND . . . . –0.3 V to VDD + 0.3 V

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW

JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105

°C/W

Lead Temperature, (Soldering, 10 sec) . . . . . . . . . . . 260

°C

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . . . 75

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

TSSOP Package, Power Dissipation . . . . . . . . . . . . . 450 mW

θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 128°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

(VREF IN/OUT = 2.5 V. All specifications –40 C to +85 C unless otherwise noted.)

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD7822/AD7825/AD7829 features proprietary ESD protection circuitry, perma-

nent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore,

proper ESD precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

TIMING CHARACTERISTICS1, 2

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