REV. 0

AD8019

–4–

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the AD8019 features proprietary ESD protection circuitry, permanent damage may occur on

devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26.4 V

Internal Power Dissipation

TSSOP-14 Package

2

. . . . . . . . . . . . . . . . . . . . . . . . . 2.2 W

SOIC-8 Package

3

. . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 W

Input Voltage (Common-Mode) . . . . . . . . . . . . . . . . . . . .

±V

S

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . .

Output Short Circuit Duration

. . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves

Storage Temperature Range . . . . . . . . . . . . –65

°C to +125°C

Operating Temperature Range . . . . . . . . . . . –40

°C to +85°C

Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

85

°C 14-lead TSSOP package: θ

°C/W.

85

°C 8-lead SOIC package: θ

°C/W.

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the AD8019

is limited by the associated rise in junction temperature. The

maximum safe junction temperature for a plastic encapsulated

device is determined by the glass transition temperature of the

plastic, approximately 150

°C. Temporarily exceeding this limit

may cause a shift in parametric performance due to a change in

the stresses exerted on the die by the package.

The output stage of the AD8019 is designed for maximum load

current capability. As a result, shorting the output to common

can cause the AD8019 to source or sink 500 mA. To ensure

proper operation, it is necessary to observe the maximum power

derating curves. Direct connection of the output to either power

supply rail can destroy the device.

AMBIENT TEMPERATURE – C

2.5

2.0

1.5

1.0

0.5

0

–40 –30 –20 –10

010

20

30

40

50

60

70

80

SOIC

TSSOP

Figure 2. Plot of Maximum Power Dissipation vs.

°C

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Description

Option

AD8019ARU

–40

°C to +85°C

14-Lead TSSOP

RU-14

AD8019ARU-Reel

–40

°C to +85°C

14-Lead TSSOP

RU-14 Reel

AD8019ARU-EVAL

–40

°C to +85°C

Evaluation Board

ARU-EVAL

AD8019AR

–40

°C to +85°C

8-Lead SOIC

R-8

AD8019AR-Reel

–40

°C to +85°C

8-Lead SOIC

R-8 Reel

AD8019AR-EVAL

–40

°C to +85°C

Evaluation Board

AR EVAL