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AD9281ARS Datasheet(PDF) 13 Page - Analog Devices |
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AD9281ARS Datasheet(HTML) 13 Page - Analog Devices |
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13 / 19 page ![]() AD9281 –13– REV. E ANALOG CIRCUITS DIGITAL LOGIC ICs V A A D DVSS AVSS A B IA ID AVDD DVDD LOGIC SUPPLY D A VIN CSTRAY CSTRAY GND A = ANALOG D = DIGITAL ADC IC DIGITAL CIRCUITS A A Figure 31. Ground and Power Consideration These characteristics result in both a reduction of electro- magnetic interference (EMI) and an overall improvement in performance. It is important to design a layout that prevents noise from cou- pling onto the input signal. Digital signals should not be run in parallel with the input signal traces and should be routed away from the input circuitry. Separate analog and digital grounds should be joined together directly under the AD9281 in a solid ground plane. The power and ground return currents must be carefully managed. A general rule of thumb for mixed signal layouts dictates that the return currents from digital cir- cuitry should not pass through critical analog circuitry. Transients between AVSS and DVSS will seriously degrade performance of the ADC. If the user cannot tie analog ground and digital ground together at the ADC, he should consider the configuration in Figure 32. Another input and ground technique is shown in Figure 32. A separate ground plane has been split for RF or hard to manage signals. These signals can be routed to the ADC differentially or single ended (i.e., both can either be connected to the driver or RF ground). The ADC will perform well with several hundred mV of noise or signals between the RF and ADC analog ground. DATA ANALOG GROUND DIGITAL GROUND LOGIC ADC AIN BIN RF GROUND Figure 32. RF Ground Scheme At the receiver, the demodulation of a QAM signal back into its separate I and Q components is essentially the modulation process explain above but in the reverse order. A common and traditional implementation of a QAM demodulator is shown in Figure 30. In this example, the demodulation is performed in the analog domain using a dual, matched ADC and a quadra- ture demodulator to recover and digitize the I and Q baseband signals. The quadrature demodulator is typically a single IC containing two mixers and the appropriate circuitry to generate the necessary 90 ° phase shift between the I and Q mixers’ local oscillators. Before being digitized by the ADCs, the mixed down baseband I and Q signals are filtered using matched ana- log filters. These filters, often referred to as Nyquist or Pulse- Shaping filters, remove images-from the mixing process and any out-of-band. The characteristics of the matching Nyquist filters are well defined to provide optimum signal-to-noise (SNR) performance while minimizing intersymbol interference. The ADC’s are typically simultaneously sampling their respective inputs at the QAM symbol rate or, most often, at a multiple of it if a digital filter follows the ADC. Oversampling and the use of digital filtering eases the implementation and complexity of the analog filter. It also allows for enhanced digital processing for both carrier and symbol recovery and tuning purposes. The use of a dual ADC such as the AD9281 ensures excellent gain, offset, and phase matching between the I and Q channels. 90°C FROM PREVIOUS STAGE QUADRATURE DEMODULATOR LO I ADC DSP OR ASIC CARRIER FREQUENCY NYQUIST FILTERS Q ADC DUAL MATCHED ADC Figure 30. Typical Analog QAM Demodulator GROUNDING AND LAYOUT RULES As is the case for any high performance device, proper ground- ing and layout techniques are essential in achieving optimal performance. The analog and digital grounds on the AD9281 have been separated to optimize the management of return currents in a system. Grounds should be connected near the ADC. It is recommended that a printed circuit board (PCB) of at least four layers, employing a ground plane and power planes, be used with the AD9281. The use of ground and power planes offers distinct advantages: 1. The minimization of the loop area encompassed by a signal and its return path. 2. The minimization of the impedance associated with ground and power paths. 3. The inherent distributed capacitor formed by the power plane, PCB insulation and ground plane. |
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