REV. C

ADG428/ADG429

–4–

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the ADG428/ADG429 features proprietary ESD protection circuitry, permanent

damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper

ESD precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

1

°C unless otherwise noted.)

Analog, Digital Inputs

2

30 mA, Whichever Occurs First

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA

(Pulsed at 1 ms, 10% Duty Cycle Max)

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . . –40

°C to +85°C

Extended (T Version) . . . . . . . . . . . . . . . . –55

°C to +125°C

Storage Temperature Range . . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 900 mW

θ

. . . . . . . . . . . . . . . . . . . . . 73

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300

°C

Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW

θ

. . . . . . . . . . . . . . . . . . . . 115

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260

°C

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW

θ

. . . . . . . . . . . . . . . . . . . . . 77

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

PLCC Package, Power Dissipation . . . . . . . . . . . . . . . 800 mW

θ

. . . . . . . . . . . . . . . . . . . . . 90

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

WR, RS, S or D will be clamped by internal diodes. Current

should be limited to the maximum ratings given.

ORDERING GUIDE

Model

1

Temperature Range

Package Options

2

ADG428BN

–40

°C to +85°C

N-18

ADG428BP

–40

°C to +85°C

P-20A

ADG428BR

–40

°C to +85°C

R-18

ADG428TQ

–55

°C to +125°CQ-18

ADG429BN

–40

°C to +85°C

N-18

ADG429BP

–40

°C to +85°C

P-20A

ADG429TQ

–55

°C to +125°CQ-18

NOTES

R = Small Outline IC (SOIC).

ADG429 PIN CONFIGURATIONS

DIP/SOIC

PLCC

TOP VIEW

(Not to Scale)

18

17

16

15

14

13

12

11

10

1

2

3

4

5

6

7

8

9

ADG428

D

S4

WR

A0

EN

S3

S2

S1

S8

S7

RS

A1

A2

GND

S6

S5

3

2

1

20

19

9

10

11

12

13

18

17

16

15

14

4

5

6

7

8

TOP VIEW

(Not to Scale)

PIN 1

IDENTIFIER

NC = NO CONNECT

EN

S1

S2

S3

A2

GND

S5

S6

ADG428

DIP

PLCC

TOP VIEW

(Not to Scale)

18

17

16

15

14

13

12

11

10

1

2

3

4

5

6

7

8

9

ADG429

DA

S4A

WR

A0

EN

S3A

S2A

S1A

DB

S4B

RS

A1

GND

S3B

S2B

S1B

3

2

1

20

19

9

10

11

12

13

18

17

16

15

14

4

5

6

7

8

TOP VIEW

(Not to Scale)

PIN 1

IDENTIFIER

NC = NO CONNECT

EN

S1A

S2A

S3A

GND

S1B

S2B

S3B

ADG429

ADG428 PIN CONFIGURATIONS