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ADG508F Datasheet(PDF) 4 Page - Analog Devices |
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ADG508F Datasheet(HTML) 4 Page - Analog Devices |
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4 / 12 page ![]() REV. C –4– ADG508F/ADG509F/ADG528F ABSOLUTE MAXIMUM RATINGS* (TA = +25°C unless otherwise noted) VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44 V VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V VEN, VA Digital Input . . . . . . . – 0.3 V to VDD + 2 V or 20 mA, Whichever Occurs First VS, Analog Input Overvoltage with Power ON . . . . . VSS – 25 V to VDD + 40 V VS, Analog Input Overvoltage with Power OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–40 V to +55 V Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA Peak Current, S or D (Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . . 40 mA Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . . –40 °C to +85°C Extended (T Version) . . . . . . . . . . . . . . . . –55 °C to +125°C Storage Temperature Range . . . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C Cerdip Package θ JA, Thermal Impedance 16-Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 °C/W 18-Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 °C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300 °C Plastic Package θ JA, Thermal Impedance 16-Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 °C 18-Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 °C Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260 °C SOIC Package θ JA, Thermal Impedance Narrow Body . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 °C/W Wide Body . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C PLCC Package θ JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 90 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. ADG508F/ADG509F PIN CONFIGURATIONS DIP/SOIC DIP/SOIC A0 EN A1 A2 S2 S3 S4 S5 S6 S7 S1 GND VDD DS8 1 2 16 15 5 6 7 12 11 10 3 4 14 13 89 TOP VIEW (Not to Scale) ADG508F VSS A0 EN A1 GND S2A S3A S4A S2B S3B S4B VSS S1A VDD S1B DA DB 1 2 16 15 5 6 7 12 11 10 3 4 14 13 89 TOP VIEW (Not to Scale) ADG509F ADG528F PIN CONFIGURATIONS DIP PLCC WR A0 RS A1 S1 S2 S3 S5 S6 EN VSS A2 S4 S7 D S8 VDD GND 1 2 18 17 5 6 7 14 13 12 3 4 16 15 811 910 TOP VIEW (Not to Scale) ADG528F EN VSS S3 S1 S2 19 31 220 4 5 8 6 7 12 13 911 10 18 17 14 16 15 TOP VIEW (Not to Scale) ADG528F A2 GND S6 VDD S5 NC = NO CONNECT CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although these devices feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE |
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