ADG774

–4–

REV. 0

ORDERING GUIDE

Model

Temperature Range

Package Descriptions

Package Options

ADG774BR

–40

°C to +85°C

R = 0.15" Small Outline IC (SOIC)

R-16A

ADG774BRQ

–40

°C to +85°C

RQ = 0.15" Quarter Size Outline Package (QSOP)

RQ-16

PIN CONFIGURATION

(SOIC/QSOP)

TOP VIEW

(Not to Scale)

16

15

14

13

12

11

10

9

1

2

3

4

5

6

7

8

IN

S1A

S1B

D1

S2A

S2B

D2

GND

EN

S4A

S4B

D4

S3A

S3B

D3

ADG774

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the ADG774 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

1

°C unless otherwise noted)

Analog, Digital Inputs

2

30 mA, Whichever Occurs First

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 100 mA

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 300 mA

(Pulsed at 1 ms, 10% Duty Cycle max)

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW

θ

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

QSOP Package, Power Dissipation . . . . . . . . . . . . . . . 566 mW

θ

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational sections

of this specification is not implied. Exposure to absolute maximum rating condi-

tions for extended periods may affect device reliability. Only one absolute maxi-

mum rating may be applied at any one time.

limited to the maximum ratings given.

TERMINOLOGY

Most Positive Power Supply Potential.

GND

Ground (0 V) Reference.

S

Source Terminal. May be an input or output.

D

Drain Terminal. May be an input or output.

IN

Logic Control Input.

EN

Logic Control Input.

Ohmic resistance between D and S.

∆R

ON

On Resistance match between any two channels

Flatness is defined as the difference between the

maximum and minimum value of on resistance

as measured over the specified analog signal

range.

Source Leakage Current with the switch “OFF.”

Drain Leakage Current with the switch “OFF.”

Channel Leakage Current with the switch “ON.”

Analog Voltage on Terminals D, S.

“OFF” Switch Source Capacitance.

“OFF” Switch Drain Capacitance.

Delay between applying the digital control input

and the output switching on. See Test Circuit 4.

Delay between applying the digital control input

and the output switching Off.

“OFF” time or “ON” time measured between

the 90% points of both switches, when switching

from one address state to another. See Test

Circuit 5.

Crosstalk

A measure of unwanted signal that is coupled

through from one channel to another as a result

of parasitic capacitance.

Off Isolation A measure of unwanted signal coupling through an

“OFF” switch.

Bandwidth

Frequency response of the switch in the ON

state measured at 3 dB down.

Distortion