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LTC3835 Datasheet(PDF) 23 Page - Linear Technology |
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LTC3835 Datasheet(HTML) 23 Page - Linear Technology |
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23 / 40 page ![]() LTC3890-3 23 38903f For more information www.linear.com/3890-3 applicaTions inForMaTion Topside MOSFET Driver Supply (CB, DB) Externalbootstrapcapacitors,CB,connectedtotheBOOST pinssupplythegatedrivevoltagesforthetopsideMOSFETs. Capacitor CB in the Functional Diagram is charged though external diode DB from INTVCC when the SW pin is low. When one of the topside MOSFETs is to be turned on, the driver places the CB voltage across the gate-source of the desired MOSFET. This enhances the top MOSFET switch and turns it on. The switch node voltage, SW, rises to VIN and the BOOST pin follows. With the topside MOSFET on, the boost voltage is above the input supply: VBOOST = VIN + VINTVCC. The value of the boost capacitor, CB, needs to be 100 times that of the total input capacitance of the topsideMOSFET(s).Thereversebreakdownoftheexternal Schottky diode must be greater than VIN(MAX). The external diode DB can be a Schottky diode or silicon diode, but in either case it should have low-leakage and fast recovery. Pay close attention to the reverse leakage current specification for this diode, especially at high temperatures where it generally increases substantially. For applications with output voltages greater than ~5V that are switching infrequently, a leaky diode DB can fully discharge the bootstrap capacitor CB, creating a current path from the output voltage to the BOOST pin to INTVCC. Not only does this increase the quiescent current of the converter, but it can cause INTVCC to rise to dangerous levels if the leakage exceeds the current consumption on INTVCC. Particularly, this is a concern in Burst Mode operation at no load or very light loads, where the part is switching very infrequently and the current draw on INTVCC is very low (typically about 35µA). Generally, pulse-skipping and forced continuous modes are less sensitive to leakage, since the more frequent switching keeps the bootstrap capacitor CB charged, preventing a current path from the output voltage to INTVCC. However, in cases where the converter has been operat- ing (in any mode) and then is shut down, if the leakage of diode DB fully discharges the bootstrap capacitor CB before the output voltage discharges to below ~5V, then the leakage current path can be created from the output voltage to INTVCC. In shutdown, the INTVCC pin is able to sink about 30µA. To accommodate diode leakage greater than this amount in shutdown, INTVCC can be loaded with an external resistor or clamped with a Zener diode. Alternatively, the PGOOD resistor can be used to sink the current (assuming the resistor pulls up to INTVCC) since PGOOD is pulled low when the converter is shut down. Nonetheless, using a low-leakage diode is the best choice to maintain low quiescent current under all conditions. Fault Conditions: Current Limit and Current Foldback The LTC3890-3 peak current mode control architecture limits the inductor current when the output is shorted to ground. Under short-circuit conditions with very low duty cycles, the LTC3890-3 will begin cycle skipping in order to limit the short-circuit current. In this situation the bot- tom MOSFET will be dissipating most of the power. The short-circuit ripple current is determined by the minimum on-time, tON(MIN), of the LTC3890-3 (≈90ns), the input voltage and inductor value: ∆IL(SC) = tON(MIN) VIN L The resulting average short-circuit current is: ISC =ILIM(MAX) – 1 2 ∆IL(SC) |
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