AL5811

Document number: DS35255 Rev. 1 - 2

3 of 13

www.diodes.com

January 2013

© Diodes Incorporated

AL5811

Package Thermal Data

Package

Thermal Resistance

Junction-to-case

(Note 5)

Thermal Resistance

Junction-to-Ambient

(Note 5)

MSOP-8EP

37

85°C/W (Note 6)

1.2W

U-DFN3030-6

13

71°C/W (Note 7)

1.40W

Notes:

5. Dominant conduction path via exposed pad.

6. Test condition for MSOP-8EP: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and

thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.

7. Test condition for U-DFN3030-6: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and

thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed

Symbol

Parameter

Min

Max

Unit

Supply Voltage Range Relative to GND Pin

3.5

60

V

OUT Voltage Range Relative to GND Pin

1.0

60

LED Pin Current (Note 8)

10

75

mA

Operating Ambient Temperature Range

-40

+125

°C

Note:

8. Maximum LED current is also limited by ambient temperature and power dissipation such that junction temperature should

be kept less than or equal 125°C.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

0.5

V

18

20

22

mA

70

75

80

47

50

53

46

54

LED Current Line Regulation

0.25

%

Supply Current

200

300

µA

350

LED Pin Leakage Current

RSET = Open Circuit

1

µA

Thermal Shutdown

155

°C

Thermal Shutdown Hysteresis

20

°C

Note:

9. All voltages unless otherwise stated are measured with respect to GND pin.