M891 datasheet(19/28 Pages) EPCOS

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Reflow soldering

Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D

Profile feature

Sn-Pb eutectic assembly

Pb-free assembly

Preheat and soak

- Temperature min

Tsmin

100

°C

150

°C

- Temperature max

Tsmax

150

°C

200

°C

- Time

tsmin to tsmax 60 ... 120 s

60 ... 180 s

Average ramp-up rate

Tsmax to Tp

°C/ s max.

Liquidous temperature

183

°C

217

°C

Time at liquidous

60 ... 150 s

Peak package body temperature

Tp1)

220

°C ... 235 °C2)

245

°C ... 260 °C2)

Time (tP)3) within 5

°C of specified

classification temperature (Tc)

20 s3)

30 s3)

Average ramp-down rate

Tp to Tsmax

°C/ s max.

Time 25

°C to peak temperature

maximum 6 min

maximum 8 min

1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.

2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.

3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.

Note: All temperatures refer to topside of the package, measured on the package body surface.

Number of reflow cycles: 3

Temperature measurement and compensation

B57891M

Leaded NTC thermistors, lead spacing 2.5 mm

M891

Page 19 of 28

Please read Cautions and warnings and

Important notes at the end of this document.

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