–3–

REV. F

AMP03

AMP03GBC

Parameter

Symbol

Conditions

Limit

Unit

Offset Voltage

±18 V

0.5

mV max

Gain Error

±10 V, R

Ω

0.008

% max

Input Voltage Range

IVR

±10

V min

Common-Mode Rejection

CMR

±10 V

80

dB min

Power Supply Rejection Ratio

PSRR

±6 V to ±18 V

8

µV/V max

Output Swing

Ω±12

V max

Short-Circuit Current Limit

Output Shorted to Ground

+45/–15

mA min

Supply Current

No Load

3.5

mA max

*Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed

for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±18 V

Input Voltage

Output Short-Circuit Duration . . . . . . . . . . . . . . Continuous

Storage Temperature Range

P, J Package . . . . . . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . 300

°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

Operating Temperature Range

AMP03B . . . . . . . . . . . . . . . . . . . . . . . . . –55

°C to +125°C

AMP03F, AMP03G . . . . . . . . . . . . . . . . . . –40

°C to +85°C

Package Type

JA

3

JC

Unit

Header (J)

150

18

°C/W

8-Lead PDIP (P)

103

43

°C/W

8-Lead SOIC (S)

155

40

°C/W

NOTES

otherwise noted.

±18 V, the absolute maximum input voltage is equal

to the supply voltage.

3

θ

θ

in socket for header and PDIP packages and for device soldered to printed circuit

board for SOIC package.

ORDERING GUIDE

Temperature

Package

Package

Model

1

Range

Description

Option

2

AMP03GP

–40

°C to +85°C8-Lead PDIP

P-8

AMP03BJ

–40

°C to +85°CHeader

H-08B

AMP03FJ

–40

°C to +85°CHeader

H-08B

AMP03BJ/883C

–55

°C to +125°CHeader

H-08B

AMP03GS

–40

°C to +85°C8-Lead SOIC

S-8

AMP03GS-REEL

–40

°C to +85°C8-Lead SOIC

S-8

5962-9563901MGA –55

°C to +125°CHeader

H-08B

AMP03GBC

Die

NOTES

PDIP and header packages.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AMP03 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

DICE CHARACTERISTICS

1. REFERENCE

2. –IN

3. +IN

5. SENSE

6. OUTPUT

8. NC

DIE SIZE 0.076 inch

0.076 inch, 5,776 sq. mm

(1.93 mm

1.93 mm, 3.73 sq. mm)

BURN-IN CIRCUIT

AMP03

+18V

–18V

25k

25k

25k

SLEW RATE TEST CIRCUIT

AMP03

+15V

–15V

0.1 F

0.1 F

WARNING!

ESD SENSITIVE DEVICE