LM2937 datasheet(12/24 Pages) TI

Part #	LM2937

Description	Output Current in Excess of 500 mA, Output Trimmed for 5% Tolerance Under all Operating Conditions

PDF	24 Pages

Scroll/Zoom	100%

Manufacturer	TI [Texas Instruments]

Direct Link	http://www.ti.com

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12 / 24 page

LM2937

SNVS100E – MARCH 2000 – REVISED APRIL 2013

www.ti.com

Figure 27. Maximum Power Dissipation vs. TAMB for the DDPAK/TO-263 Package

Figure 28 and Figure 29 show the information for the SOT-223 package. Figure 29 assumes a

θ(J−A) of 74°C/W

for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of +85°C.

Figure 28.

θ(J−A) vs Copper (2 ounce) Area for the

Figure 29. Maximum Power Dissipation vs TAMB for

SOT-223 Package

the SOT-223 Package

SOT-223 SOLDERING RECOMMENDATIONS

It is not recommended to use hand soldering or wave soldering to attach the small SOT-223 package to a printed

circuit board. The excessive temperatures involved may cause package cracking.

Either vapor phase or infrared reflow techniques are preferred soldering attachment methods for the SOT-223

package.

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LM2937 Datasheet(PDF) 12 Page - Texas Instruments