LM2937 datasheet(2/24 Pages) TI

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LM2937

SNVS100E – MARCH 2000 – REVISED APRIL 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Continuous

26V

Input Voltage

Transient (t

≤ 100 ms)

60V

Internal Power Dissipation(3)

Internally Limited

Maximum Junction Temperature

150°C

Storage Temperature Range

−65°C to +150°C

TO-220 (10 seconds)

260°C

DDPAK/TO-263 (10 seconds)

230°C

SOT-223 (Vapor Phase, 60 seconds)

215°C

SOT-223 (Infared, 15 seconds)

220°C

ESD Susceptibility(4)

2 kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when

operating the device outside of its rated Operating Conditions.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction

temperature for operation, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is

exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above

150°C, the LM2937 will go into thermal shutdown. For the LM2937, the junction-to-ambient thermal resistance

θJA is 65°C/W, for the

TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink,

θJA is

the sum of the LM2937 junction-to-case thermal resistance

θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the

DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area

thermally connected to the package (see Application Hints for more information on heatsinking).

(4)

ESD rating is based on the human body model, 100 pF discharged through 1.5 k

Ω.

Operating Conditions

(1)

LM2937ET, LM2937ES

−40°C ≤ TJ ≤125°C

Temperature Range(2)

LM2937IMP

−40°C ≤ TJ ≤85°C

Maximum Input Voltage

26V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when

operating the device outside of its rated Operating Conditions.

(2)

The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction

temperature for operation, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is

exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above

150°C, the LM2937 will go into thermal shutdown. For the LM2937, the junction-to-ambient thermal resistance

θJA is 65°C/W, for the

TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink,

θJA is

the sum of the LM2937 junction-to-case thermal resistance

θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the

DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area

thermally connected to the package (see Application Hints for more information on heatsinking).

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