7

■

Operating Precautions

1. Recommended Temperature Profile

(Lead-free soldering possible)

2. Recommended Hand Solder Conditions

Soldering iron temperature: 350 ± 10

℃, soldering time: within 3 seconds

3. Recommended Screen Thickness, Aperture

Opening Rate (Pattern Area Ratio)

Thickness 0.1 mm, aperture opening rate: 100%

4. PCB Warpage

Max 0.02 mm at the center of connector with the both edges of the connector as

the baseline

5. Cleaning Condition

Cleaning with IPA is possible. (Cleaning is not recommended as it may change

the feel of insertion/extraction, etc. Please consult with us when using other types

of cleaning agents.)

6. Precautions

■

In order to maintain the performance reliability, do not insert the crimp contact

into the crimp socket at a slant angle.

■

Insertion/extraction of the connector while not mounted to the PCB may cause

breakage or deformation to the contact.

■

Extracting the connector by holding the cable could result in a breakage.

■

Do not apply flux at the time of hand soldering, as it may result in flux rise.

■

This product may have slightly different hue on molded items, however, they do

not affect the product performance.

■

See the separate“DF59 Insertion/Extraction Procedure Manual” for handling

precautions at the time of insertion and extraction.

[Applicable Conditions]

1. Peak Temperature: MAX 250

℃

2. Heated Area: 220

℃ or above, within 60 sec.

3. Pre-heating Area: 150-180

℃, 90-120 sec.

4. Number of Operation: Twice or less

* The contact lead area was measured.

The conditions may change depending on the types and manufacturers of

cream solder, PCB size, and conditions of other materials used for soldering.

Please fully check the soldering condition before use.

[Remarks 1] This temperature profile is our recommended value.

50

60sec MAX

100

150

200

250

0

PRE-HEATING TIME

SOLDERING TIME

TIME

（sec）

90

∼120sec

180ç

220ç

10sec MAX

MAX 250�