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MHST05065 Datasheet(PDF) 6 Page - General Semiconductor |
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MHST05065 Datasheet(HTML) 6 Page - General Semiconductor |
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6 / 8 page ![]() 6 6 Tyco Electronics Corp. Technical Note July 1996 250 W—300 W Board-Mounted Power Modules Thermal Management for FC- and FW-Series Module Derating (continued) Natural Convection With Heat Sinks Figures 8 and 9 show the power derating for a module in natural convection with the heat sinks shown in Fig- ures 6 and 7. Natural convection is the heat transfer produced when air in contact with a hot surface is heated, causing it to rise. An open environment is required with no external forces moving the air. Figures 8 and 9 apply when the module is the only source of heat present in the system, generating airflow of approximately 10 ft./min. to 20 ft./min. Again, a typical system with other heat dissipating components will usually generate higher airflows in natural convection. 8-1318 Figure 8. Heat Sink Power Derating Curves Natural Convection, Longitudinal Ori- entation 8-1319 Figure 9. Heat Sink Power Derating Curves Natural Convection, Transverse Ori- entation Figures 8 and 9 can be used to predict which heat sink a module will require in a natural convection environ- ment, as shown in the following example. Example 3: Sizing a Heat Sink What heat sink would be appropriate for a transverse mounted FW300A1 in a natural convection environ- ment at 54 V input and 2/3 load with a maximum ambi- ent temperature of 35 °C? Solution: Given: VI = 54 V, Io = 2/3(60) = 40 A, TA = 35 °C Determine PD (Figure 2): PD = 35 W Determine Heat Sink (Figure 9): 1 1/2 in. heat sink allows up to TA = 35 °C 0 10 203040 100 0 40 60 70 LOCAL AMBIENT TEMPERATURE, TA ( °C) 30 20 10 90 80 70 60 50 1 1/2 in. 1 in. 1/2 in. 1/4 in. NONE 50 0 10 203040 100 0 40 60 70 LOCAL AMBIENT TEMPERATURE, TA ( °C) 30 20 10 90 80 70 60 50 1 1/2 in. 1 in. 1/2 in. 1/4 in. NONE 50 |
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