Product Specification

PE42821

Page 8 of 12

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Thermal Data

Though the insertion loss for this part is very low,

when handling high power RF signals, the junction

temperature rises significantly.

VSWR conditions that present short circuit loads to

the part can cause significantly more power

dissipation than with proper matching.

Special consideration needs to be made in the

design of the PCB to properly dissipate the heat

away from the part and maintain the 85°C maximum

case temperature. It is recommended to use best

design practices for high power QFN packages:

multi-layer PCBs with thermal vias in a thermal pad

soldered to the slug of the package. Special care

also needs to be made to alleviate solder voiding

under the part.

Table 6. Theta JC

Parameter

Min

Typ

Max

Unit

Theta JC (+85°C)

20

C/W