TPS40054

TPS40055

TPS40057

SLUS593H – DECEMBER 2003 – REVISED JULY 2012

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

PACKAGE

APPLICATION

OUTPUT SUPPLY

MINIMUM QUANTITY

DEVICE NUMBER

Tube

90

TPS40054PWP

Source

Tape and Reel

2000

TPS40054PWPR

Tube

90

TPS40055PWP

Plastic HTSSOP

–40°C to 85°C

Source/Sink

(PWP)

Tape and Reel

2000

TPS40055PWPR

Tube

90

TPS40057PWP

Source/Sink with

prebias

Tape and Reel

2000

TPS40057PWPR

DEVICE RATINGS

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted

(1)

TPS40054

TPS40055

UNIT

TPS40057

VFB, SS/SD, SYNC

–0.3 to 6

VIN, SW

–0.3 to 45

Input voltage range

SW, transient < 50 ns

–2.5

–5.0

–0.3 to 11

COMP, RT, SS/SD

–0.3 to 6

Output voltage

range

KFF

5

mA

Output current

RT

200

µA

150

Operating junction temperature range

–40 to 125

°C

Storage temperature

–55 to 150

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Device may shut down at junction temperatures below 150°C

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

Input voltage

8

40

V

Operating free-air temperature

–40

85

°C

THERMAL INFORMATION

PWP (20 PINS)

UNITS

Junction-to-ambient thermal resistance

38.3

Junction-to-case (top) thermal resistance

28.0

Junction-to-board thermal resistance

9.0

°C/W

Junction-to-top characterization parameter

0.4

Junction-to-board characterization parameter

8.9

Junction-to-case (bottom) thermal resistance

2.9

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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Product Folder Link(s): TPS40054 TPS40055 TPS40057