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TPS40054

TPS40055

TPS40057

www.ti.com

SLUS593H – DECEMBER 2003 – REVISED JULY 2012

(46)

LAYOUT CONSIDERATIONS

MOSFET PACKAGING

MOSFET package selection depends on MOSFET power dissipation and the projected operating conditions. In

general, for a surface-mount applications, the DPAK style package provides the lowest thermal impedance (

and, therefore, the highest power dissipation capability. However, the effectiveness of the DPAK depends on

proper layout and thermal management. The

area and thickness. In most cases, a lowest thermal impedance of 40°C/W requires one square inch of 2-ounce

copper on a G-10/FR-4 board. Lower thermal impedances can be achieved at the expense of board area. Please

refer to the selected MOSFET's data sheet for more information regarding proper mounting.

GROUNDING AND CIRCUIT LAYOUT CONSIDERATIONS

The TPS4005x provides separate signal ground (SGND) and power ground (PGND) pins. It is important that

circuit grounds are properly separated. Each ground should consist of a plane to minimize its impedance if

possible. The high power noisy circuits such as the output, synchronous rectifier, MOSFET driver decoupling

capacitor (BP10), and the input capacitor should be connected to PGND plane at the input capacitor.

SGND plane should only make a single point connection to the PGND plane.

Component placement should ensure that bypass capacitors (BP10 and BP5) are located as close as possible to

their respective power and ground pins. Also, sensitive circuits such as FB, RT and ILIM should not be located

near high dv/dt nodes such as HDRV, LDRV, BOOST, and the switch node (SW).

Copyright © 2003–2012, Texas Instruments Incorporated

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