LTC2970/LTC2970-1

35

29701fc

Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However,

no responsibility is assumed for its use. Linear Technology Corporation makes no representation that

the interconnection of its circuits as described herein will not infringe on existing patent rights.

12.7k

10

Ω

0.1

μF

22

μF

0.1

μF

100

Ω

29701 F07

LTC2970

ALERT

SCL

SDA

REF

GND ASEL0 ASEL1

+

–

8V TO 15V

0.1

μF

Figure 7. Programmable Reference Application Circuit

UFD Package

24-Lead Plastic QFN (4mm × 5mm)

(Reference LTC DWG # 05-08-1696)

PACKAGE DESCRIPTIO

4.00

± 0.10

(2 SIDES)

2.65

± 0.10

(2 SIDES)

5.00

± 0.10

(2 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40

± 0.05

23 24

1

2

BOTTOM VIEW—EXPOSED PAD

3.65

± 0.10

(2 SIDES)

0.75

± 0.05

R = 0.115

TYP

PIN 1 NOTCH

R = 0.30 TYP

0.25

± 0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UFD24) QFN 0505

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.70

±0.05

0.25

±0.05

0.50 BSC

2.65

± 0.05

(2 SIDES)

3.65

± 0.05

(2 SIDES)

4.10

± 0.05

5.50

± 0.05

3.10

± 0.05

4.50

± 0.05

PACKAGE OUTLINE

TYPICAL APPLICATIO