AD8021 datasheet(27/28 Pages) AD

27 / 28 page

AD7986

Rev. B | Page 27 of 28

OUTLINE DIMENSIONS

2.65

2.50 SQ

2.35

3.75

BSC SQ

4.00

BSC SQ

COMPLIANT

TO JEDEC STANDARDS MO-220-VGGD-1

0.50

BSC

PIN 1

INDICATOR

0.50

0.40

0.30

TOP VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

COPLANARITY

0.08

1.00

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

EXPOSED

PAD

(BOTTOM VIEW)

0.60 MAX

0.25 MIN

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 39. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad

(CP-20-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model1, 2, 3

Temperature Range

Package Description

Package

Option

Ordering

Quantity

AD7986BCPZ

−40°C to +85°C

20-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Tray

CP-20-4

490

AD7986BCPZ-RL7

−40°C to +85°C

20-Lead Lead Frame Chip Scale Package [LFCSP_VQ], 7”Tape and Reel

CP-20-4

1,500

EVAL-AD7986EBZ

Evaluation Board

EVAL-CED1Z

Converter Evaluation and Development Board

1 Z = RoHS Compliant Part.

2 The EVAL-AD7986EBZ can be used as a standalone evaluation board or in conjunction with the EVAL-CED1Z for evaluation/demonstration purposes.

3 The EVAL-CED1Z allows a PC to control and communicate with all Analog Devices evaluation boards ending in the EB designator.

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