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AD871SD Datasheet(PDF) 3 Page - List of Unclassifed Manufacturers

Part # AD871SD
Description  MICROCIRCUIT, LINEAR, A/D CONVERTER, 12-BIT, 5 MSPS, MONOLITHIC SILICON
PDF  12 Pages
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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AD871SD Datasheet(HTML) 3 Page - List of Unclassifed Manufacturers

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STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-94686
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
A
SHEET
3
DSCC FORM 2234
APR 97
1.3 Absolute maximum ratings. 1/
AVDD to AGND ............................................................................................. -0.5 V to +6.5 V
AVSS to AGND ............................................................................................. -6.5 V to +0.5 V
DVDD, DRVDD to DGND, DRGND 2/ ........................................................... -0.5 V to +6.5 V
DRVDD to DVDD 2/ ....................................................................................... -6.5 V to +6.5 V
DRGND to DGND 2/ ................................................................................... -0.3 V to +0.3 V
AGND to DGND .......................................................................................... -1 V to +1 V
AVDD to DVDD ............................................................................................... -6.5 V to +6.5 V
Clock input, OEN to DGND 2/ .................................................................... -0.5 V to DVDD + 0.5 V
Digital outputs to DGND .............................................................................. -0.5 V to DVDD + 0.3 V
REFIN to AGND .......................................................................................... AVSS to AVDD
VINA, VINB, REFIN to AGND ......................................................................... -6.5 V to +6.5 V
Power dissipation (PD) ................................................................................. 1.3 W
Thermal resistance, junction-to-case (
θJC) .................................................. See MIL-STD-1835
Thermal resistance, junction-to-ambient (
θJA):
Case outline X ......................................................................................... 60
°C/W
Case outline Y ......................................................................................... 70
°C/W
Storage temperature range ......................................................................... -65
°C to +150°C
Lead temperature (soldering, 10 seconds) ................................................. +300
°C
1.4 Recommended operating conditions.
Operating temperature range (TA) ............................................................... -55
°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 -
Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
List of Standard Microcircuit Drawings.
MIL-HDBK-780 -
Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
1/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/
DRVDD, DRGND, and OEN are applicable only to device type 02.



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