2MHz, High-Brightness LED Drivers with

Integrated MOSFET and High-Side Current Sense

5

vs. TEMPERATURE

TEMPERATURE (

°C)

110

95

80

65

50

35

20

5

-10

-25

0.2

0.3

0.4

0.5

0.6

0.7

0.1

-40

125

vs. TEMPERATURE

25.5

26.0

26.5

27.0

27.5

28.0

28.5

29.0

29.5

30.0

25.0

TEMPERATURE (

°C)

110

95

80

65

50

35

20

5

-10

-25

-40

125

Typical Operating Characteristics (continued)

noted.)

Pin Description

PIN

NAME

FUNCTION

1

CS

Current-Sense Input. Connect a resistor between IN and CS to program the LED current.

2

IN

Positive Supply Voltage Input. Bypass with a 1µF or higher value capacitor to GND.

3

GND

Ground

4

PGND

Power Ground

5, 6

LX

Switching Node

7

DIM

Logic-Level Dimming Input. Drive DIM low to turn off the current regulator. Drive DIM high to

enable the current regulator.

8

TEMP_I

Thermal Foldback Control and Linear Dimming Input. Bypass with a 0.01µF capacitor to GND if

thermal foldback or analog dimming is used. See the Thermal Foldback section.

—EP

Exposed Pad. Connect EP to a large-area ground plane for effective power dissipation. Do not use

as the IC ground connection.

Detailed Description

The MAX16832A/MAX16832C are step-down, constant-

current, HB LED drivers. These devices operate from a

+6.5V to +65V input voltage range. The maximum output

high-side current-sense resistor sets the output current

and a dedicated PWM dimming input enables pulsed

LED dimming over a wide range of brightness levels.

A high-side current-sensing scheme and an on-board

current-setting circuitry minimize the number of exter-

nal components while delivering LED current with ±3%

accuracy, using a 1% sense resistor. See Figure 1 for a

functional diagram.