Copyright

© ANPEC Electronics Corp.

Rev. A.7 - Oct., 2011

APW7098

www.anpec.com.tw

3

Symbol

Parameter

Rating

Unit

BOOT1/2 to AGND Voltage

<200ns pulse width

>200ns pulse width

-0.3 ~ 42

-0.3 ~ 30

V

VCCDRV to AGND Voltage

-0.3 ~ 15

V

-0.3 ~ 7

V

REFIN/EN, MODE to AGND Voltage

-0.3 ~ 7

V

Input Voltage (REFOUT/POK, SS, FB, COMP, DROOP, RT, CSP1/2,

CSN1/2 to AGND)

V

PGND to AGND Voltage

-0.3 ~ +0.3

V

Maximum Power Dissipation

Limited Internally

W

Maximum Junction Temperature

150

Storage Temperature Range

-65 ~ 150

Maximum Soldering Temperature, 10 Seconds

260

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Resistance

(Note 2)

QFN4x4-24A

45

θ

JC

Junction-to-Case Resistance

(Note 3)

QFN4x4-24A

7

°C/W

Note 2 :

θ

pad of QFN4x4-24A is soldered directly on the PCB.

Note 3: The case temperature is measured at the center of the exposed pad on the underside of the QFN4x4-24A package.

Symbol

Parameter

Range

Unit

VCC Supply Voltage

8 ~ 13.2

V

5

± 5%

V

Converter Output Voltage

0.6 ~ 2.5

V

PWM 1 Converter Input Voltage

3.1 ~ 13.2

V

PWM 2 Converter Input Voltage

3.1 ~ 13.2

V

Converter Output Current

~ 60

A

REFIN/EN Input Voltage

0 ~ 2

V

Ambient Temperature

-20 ~ 70

Junction Temperature

-20 ~ 125

Linear Regulator Output Capacitor

0.8 ~ 15

µF

5VCC Linear Regulator Output Capacitor

0.8 ~ 15

µF

Note 4 : Refer to the typical application circuits.

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.