Copyright

© ANPEC Electronics Corp.

Rev. A.3 - Oct., 2013

www.anpec.com.tw

2

APA2012

Pin Configuration

Top View

VON

(A3)

PGND

(B3)

VOP

(C3)

GND

(A2)

PVDD

(B2)

SD

(C2)

INP

(A1)

VDD

(B1)

INN

(C1)

1.2mm

WLCSP1.2x1.2-9

SD 1

VDD 3

8 VOP

INN 2

INP 4

7 PVDD

5 VON

6 GND

TDFN3x3-8

(Top View)

Ordering and Marking Information

Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

(Over operating free-air temperature range unless otherwise noted.)

Symbol

Parameter

Rating

Unit

Supply Voltage (VDD, PVDD)

-0.3 to 6.3

V

Input Voltage (SD, INP, INN)

-0.3 to 3.6

V

Maximum Junction Temperature

150

Storage Temperature Range

-65 to +150

Soldering Temperature Range

260

Power Dissipation

Internally Limited

W

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

APA2012

Package Code

HA : WLCSP1.2x1.2-9

QB : TDFN3x3-8

Operating Ambient Temperature Range

I : -40 to 85

Handling Code

TR : Tape & Reel

Assembly Material

Handling Code

Temperature Range

Package Code

G : Halogen and Lead Free Device

Assembly Material

APA2012 HA:

A2

X

X - Date Code

APA2012 QB:

APA

2012

X

X - Date Code