MICROPOWER,

ULTRA-SENSITIVE

HALL-EFFECT SWITCHES

www.allegromicro.com

9

PACKAGE DESIGNATOR ‘LH’

(fits SC-74A solder-pad layout)

NOTES: 1.

Tolerances on package height and width represent allowable mold offsets. Dimensions given are

measured at the widest point (parting line).

2.

Exact body and lead configuration at vendor’s option within limits shown.

3.

Height does not include mold gate flash.

4.

Where no tolerance is specified, dimension is nominal.

Dimensions in Inches

(for reference only)

Dimensions in Millimeters

(controlling dimensions)

Dwg. MA-011-3 in

12

0.039

0.094

0.037

0.028

3

Dwg. MA-011-3 mm

12

1.00

2.40

0.95

0.70

3

Dwg. MA-010-3B in

12

0.006

0.000

0.0079

0.0050

0.122

0.114

0.083

0.073

0.118

0.106

0.037

BSC

0.022

REF

0.020

0.012

3

0

0.043

0.035

0.049

0.035

Dwg. MA-010-3B mm

12

0.15

0.00

0.20

0.127

3.10

2.90

2.10

1.85

3.00

2.70

0.95

BSC

0.55

REF

0.50

0.30

3

0

1.10

0.90

1.25

0.90