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3972 Datasheet(PDF) 8 Page - Allegro MicroSystems |
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3972 Datasheet(HTML) 8 Page - Allegro MicroSystems |
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8 / 12 page ![]() 3972 DUAL DMOS FULL-BRIDGE MICROSTEPPING PWM MOTOR DRIVER 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 8 Current Sensing. To minimize inaccuracies in sensing the I PEAK current level caused by ground-trace IR drops, the sense resistor should have an independent ground return to the ground terminal of the device. For low-value sense resistors, the IR drops in the sense resistor’s PCB traces can be significant and should be taken into account. The use of sockets should be avoided as they can introduce variation in R S due to their contact resistance. Thermal Protection. Circuitry turns off all drivers when the junction temperature reaches 165 °C typically. It is intended only to protect the device from failures due to excessive junction temperature and should not imply that output short circuits are permitted. Thermal shutdown has a hysteresis of approximately 15 °C. Serial Port Write Timing Operation. Data is clocked into a shift register on the rising edge of CLOCK signal. Normally, STROBE will be held high, and only will be brought low to initiate a write cycle. The data is written MSB first, followed by the word-select bit. Refer to serial port diagram for timing requirements. DATA CLOCK Dwg. WP-038-1 STROBE A F B G C D E D18 D0 H SLEEP D17 APPLICATIONS INFORMATION A. Minimum Data Setup Time ..................................... 15 ns B. Minimum Data Hold Time ...................................... 10 ns C. Minimum Setup Strobe to Clock Rising Edge ...... 150 ns D. Minimum Clock High Pulse Width ......................... 40 ns E. Minimum Clock Low Pulse Width ......................... 40 ns F. Minimum Setup Clock Rising Edge to Strobe ........ 50 ns G. Minimum Strobe Pulse Width ............................... 150 ns H. Minimum Setup Sleep to Strobe Falling ................. 50 µs Layout. The printed wiring board should use a heavy ground plane. For optimum electrical and thermal performance, the driver should be soldered directly onto the board. The ground side of R S should have an individual path to the ground pin(s) of the driver. This path should be as short as physically possible and should not have any other components connected to it. The load supply pin, V BB, should be decoupled with an electrolytic capacitor (>47 µF is recommended) placed as close to the driver as is possible. |
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