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HF81GS Datasheet(PDF) 2 Page - Monolithic Power Systems |
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HF81GS Datasheet(HTML) 2 Page - Monolithic Power Systems |
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2 / 10 page ![]() HF81 – X CAPACITOR BLEEDER HF81 Rev. 1.12 www.MonolithicPower.com 2 11/15/2012 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2012 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking HF81GS SOIC8 HF81 * For Tape & Reel, add suffix –Z (e.g. HF81GS–Z); PACKAGE REFERENCE NC L1 L1 NC NC L2 L2 NC 1 2 3 4 8 7 6 5 TOP VIEW ABSOLUTE MAXIMUM RATINGS (2) L1-L2 Pin Voltage .................................... 1000V Storage Temperature................. -65°C to 150°C Lead Temperature ....................................260°C Continuous Power Dissipation (TA = +25°C) (3) ………………………………………………...1.4W Single Avalanche Energy....................... 70μJ (4) Avalanche Current .................................80mA (4) Junction Temperature...............................150°C Recommended Operating Conditions (5) Operating Junction Temp. (TJ). -40°C to +125°C Thermal Resistance (6) θJA θJC SOIC8..................................... 90 ...... 45... °C/W Notes: 2) Exceeding these ratings may damage the device. 3) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 4) L=5mH, Vgs=10V, VDD=1.4V 5) The device is not guaranteed to function outside of its operating conditions. 6) Measured on JESD51-7, 4-layer PCB. |
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