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PIC16 Datasheet(PDF) 330 Page - Microchip Technology |
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PIC16 Datasheet(HTML) 330 Page - Microchip Technology |
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330 / 418 page ![]() PIC16(L)F1508/9 DS40001609C-page 330 2011-2013 Microchip Technology Inc. D019B — 6 16 A1.8 FOSC = 32 kHz, External Clock (ECL), Low-Power mode —8 22 A3.0 D019B — 13 28 A 2.3 FOSC = 32 kHz, External Clock (ECL), Low-Power mode — 15 31 A 3.0 — 16 36 A 5.0 D019C — 19 35 A1.8 FOSC = 500 kHz, External Clock (ECL), Low-Power mode —32 55 A3.0 D019C — 31 52 A 2.3 FOSC = 500 kHz, External Clock (ECL), Low-Power mode — 38 65 A 3.0 — 44 74 A 5.0 D020 — 140 210 A1.8 FOSC = 4 MHz, EXTRC (Note 3) — 250 330 A3.0 D020 — 210 290 A 2.3 FOSC = 4 MHz, EXTRC (Note 3) — 280 380 A 3.0 — 350 470 A 5.0 D021 — 1135 1700 A3.0 FOSC = 20 MHz, HS Oscillator D021 — 1170 1800 A 3.0 FOSC = 20 MHz, HS Oscillator — 1555 2300 A 5.0 TABLE 29-2: SUPPLY CURRENT (IDD)(1,2) (CONTINUED) PIC16LF1508/9 Standard Operating Conditions (unless otherwise stated) PIC16F1508/9 Param. No. Device Characteristics Min. Typ† Max. Units Conditions VDD Note * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 3: For EXTRC oscillator configurations, current through REXT is not included. The current through the resis- tor can be extended by the formula IR = VDD/2REXT (mA) with REXT in k . |
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