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MP7741 Datasheet(PDF) 12 Page - Monolithic Power Systems |
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MP7741 Datasheet(HTML) 12 Page - Monolithic Power Systems |
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12 / 14 page ![]() MP7741 – 10W CLASS D MONO SINGLE ENDED AUDIO AMPLIFIER MP7741 Rev. 1.0 www.MonolithicPower.com 12 2/17/2011 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2011 MPS. All Rights Reserved. PCB Layout The circuit layout is critical for optimum performance and low output distortion and noise. It is highly recommended to duplicate EVB layout for optimum performance. If change is necessary, please follow these guidelines and take Figure 4 for references. 1) Place the following components as close to the MP7741 as possible: Bootstrap Cap CBS is used to supply the gate drive current to the internal high-side MOSFET. Place CBS as close to pins 8 (BS) and 9 (SW) as possible. Power Supply Bypass CBYP carries the transient current for the switching power stage. To prevent overstressing of the MP7741 and excessive noise at the output, place CBYP as close to pins 7 (VDD) and 10 (PGND) as possible. Integrated Capacitors CINT is used to set the amplifier switching frequencies and are typically on the order of a few nF. Place CINT as close to pins 1 (PIN) and 2 (NIN) as possible to reduce distortion and noise. Reference Bypass Capacitors CR filters the ½ VDD reference voltages. Place CR as close to the IC as possible to improve power supply rejection and reduce distortion and noise at the output. 2) The Inductor-Capacitor (LC) filter converts the pulse train at SW to the output voltage that drives the speaker. Please keep the filter capacitor close to the inductor. 3) When laying out the PCB, use two separate ground planes, analog ground (AGND) and power ground (PGND), and connect the two grounds together at a single point (usually around the bulk bypass capacitor) to prevent noise injection into the amplifier input to reduce distortion. 4) Keep the sensitive feedback signal trace on the input side and shield the trace with the AGND plane. Make sure that any traces carrying the switch node (SW) voltages are separated far from any input signal traces. If it is required to run the SW trace near the input, shield the input with a ground plane between the traces. If multiple amplifiers are used on a single board, make sure that each channel is physically separated to prevent crosstalk. Make sure that all inductors used on a single circuit board have the same orientation. If multiple amplifiers are used on a single board, make sure that the power supply is routed from the source to each channel individually, not serially. This prevents channel-to-channel coupling through the power supply input. Electro-Magnetic Interference (EMI) Considerations Due to the switching nature of the Class D amplifier, care must be taken to minimize the effects of electromagnetic interference from the amplifier. However, with proper component selection and careful attention to circuit layout, the effects of the EMI due to the amplifier switching can be minimized. The power inductors are a potential source of radiated emissions. For the best EMI performance, use toroidal inductors, since the magnetic field is well contained inside the core. However toroidal inductors can be expensive to wind. For a more economical solution, use shielded gapped ferrite or shielded ferrite bobbin core inductors. These inductors typically do not contain the field as well toroidal inductors, but usually can achieve a better balance of good EMI performance with low cost. The size of high-current loops that carry rapidly changing currents needs to be minimized. To do this, make sure that the VDD bypass capacitors are as close to the MP7741 as possible. Nodes that carry rapidly changing voltage, such as SW, need to be made as small as possible. If sensitive traces run near a trace connected to SW, place a ground shield between the traces. |
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