Electronic Components Datasheet Search
  English  ▼

X  

MP7741 Datasheet(PDF) 12 Page - Monolithic Power Systems

Part # MP7741
Description  10W Class D Mono Single Ended Audio Amplifer
PDF  14 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP7741 Datasheet(HTML) 12 Page - Monolithic Power Systems

Back Button MP7741 Datasheet HTML 6Page - Monolithic Power Systems MP7741 Datasheet HTML 7Page - Monolithic Power Systems MP7741 Datasheet HTML 8Page - Monolithic Power Systems MP7741 Datasheet HTML 9Page - Monolithic Power Systems MP7741 Datasheet HTML 10Page - Monolithic Power Systems MP7741 Datasheet HTML 11Page - Monolithic Power Systems MP7741 Datasheet HTML 12Page - Monolithic Power Systems MP7741 Datasheet HTML 13Page - Monolithic Power Systems MP7741 Datasheet HTML 14Page - Monolithic Power Systems  
Zoom Inzoom in Zoom Outzoom out
 12 / 14 page
background image
MP7741 – 10W CLASS D MONO SINGLE ENDED AUDIO AMPLIFIER
MP7741 Rev. 1.0
www.MonolithicPower.com
12
2/17/2011
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2011 MPS. All Rights Reserved.
PCB Layout
The circuit layout is critical for optimum
performance and low output distortion and noise.
It is highly recommended to duplicate EVB layout
for
optimum
performance.
If
change
is
necessary, please follow these guidelines and
take Figure 4 for references.
1) Place the following components as close to
the MP7741 as possible:
Bootstrap Cap
CBS is used to supply the gate drive current to the
internal high-side MOSFET. Place CBS as close
to pins 8 (BS) and 9 (SW) as possible.
Power Supply Bypass
CBYP carries the transient current for the
switching power stage. To prevent overstressing
of the MP7741 and excessive noise at the output,
place CBYP as close to pins 7 (VDD) and 10
(PGND) as possible.
Integrated Capacitors
CINT is used to set the amplifier switching
frequencies and are typically on the order of a
few nF. Place CINT as close to pins 1 (PIN) and 2
(NIN) as possible to reduce distortion and noise.
Reference Bypass Capacitors
CR filters the ½ VDD reference voltages. Place
CR as close to the IC as possible to improve
power supply rejection and reduce distortion and
noise at the output.
2) The Inductor-Capacitor (LC) filter converts the
pulse train at SW to the output voltage that drives
the speaker. Please keep the filter capacitor
close to the inductor.
3) When laying out the PCB, use two separate
ground planes, analog ground (AGND) and
power ground (PGND), and connect the two
grounds together at a single point (usually
around the bulk bypass capacitor) to prevent
noise injection into the amplifier input to reduce
distortion.
4) Keep the sensitive feedback signal trace on
the input side and shield the trace with the AGND
plane. Make sure that any traces carrying the
switch node (SW) voltages are separated far
from any input signal traces. If it is required to run
the SW trace near the input, shield the input with
a ground plane between the traces. If multiple
amplifiers are used on a single board, make sure
that each channel is physically separated to
prevent crosstalk. Make sure that all inductors
used on a single circuit board have the same
orientation.
If multiple amplifiers are used on a single board,
make sure that the power supply is routed from
the source to each channel individually, not
serially.
This
prevents
channel-to-channel
coupling through the power supply input.
Electro-Magnetic
Interference
(EMI)
Considerations
Due to the switching nature of the Class D
amplifier, care must be taken to minimize the
effects of electromagnetic interference from the
amplifier. However, with proper component
selection and careful attention to circuit layout,
the effects of the EMI due to the amplifier
switching can be minimized.
The power inductors are a potential source of
radiated
emissions.
For
the
best
EMI
performance, use toroidal inductors, since the
magnetic field is well contained inside the core.
However toroidal inductors can be expensive to
wind. For a more economical solution, use
shielded gapped ferrite or shielded ferrite bobbin
core inductors. These inductors typically do not
contain the field as well toroidal inductors, but
usually can achieve a better balance of good EMI
performance with low cost.
The size of high-current loops that carry rapidly
changing currents needs to be minimized. To do
this, make sure that the VDD bypass capacitors
are as close to the MP7741 as possible.
Nodes that carry rapidly changing voltage, such
as SW, need to be made as small as possible. If
sensitive traces run near a trace connected to
SW, place a ground shield between the traces.



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com