THS3110

THS3111

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

Dual supply

±5

±15

Supply voltage

V

Single supply

10

30

Commercial

0

+70

Industrial

–40

+85

°C

–40

+125

–40

+85

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature, unless otherwise noted.

UNIT

33 V

± 4 V

(2)

300 mA

Continuous power dissipation

See Dissipation Ratings Table

(3)

+150°C

(4)

+125°C

Commercial

0°C to +70°C

Industrial

–40°C to +85°C

–65°C to +125°C

ESD ratings:

HBM

900

CDM

1500

MM

200

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The THS3110 and THS3111 may incorporate a PowerPAD on the underside of the chip. This feature acts as a heatsink and must be

connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction

temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the

PowerPAD™ thermally-enhanced package.

(3)

The absolute maximum temperature under any condition is limited by the constraints of the silicon process.

(4)

The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may

result in reduced reliability and/or lifetime of the device.

Copyright © 2003–2009, Texas Instruments Incorporated

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Product Folder Link(s): THS3110 THS3111