LMZ10501

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SNVS677D – MAY 2011 – REVISED MARCH 2013

Use of multiple 4.7 µF or 2.2µF output capacitors can be considered for reduced effective ESR and smaller

output voltage ripple. In addition to the main output capacitor, small 0.1µF – 0.01µF parallel capacitors can be

used to reduce high frequency noise.

PACKAGE CONSIDERATIONS

The nano module package includes an LTCC inductor on the bottom and a micro SMD die mounted on top. The

die has exposed edges and can be sensitive to ambient light. For applications with direct high intensity ambient

red, infrared, LED, or natural light it is recommended to have the device shielded from the light source to avoid

abnormal behavior.

Since the die is exposed on top of the package, care should be taken when picking and placing the module on

the board.

Use the following recommendations when utilizing machine placement:

•

Use 1.06mm (42mil) or smaller nozzle size so that the nozzle head does not touch the outer area of the

exposed die.

•

Use a soft tip pick and place head.

•

Add 0.05mm to the component thickness so that the device will be released 0.05mm (2mil) into the solder

paste without putting pressure or splashing the solder paste.

•

Slow the pick arm when picking the part from the tape and reel carrier and when depositing the IC on the

board.

•

If the machine releases the component by force, use minimum force or no more than 3 Newtons.

•

For PCBs with surface mount components on both sides, it is suggested to put the LMZ10501 on the top

side. In case the application requires bottom side placement, a reflow fixture may be required to protect the

module during the second reflow.

For manual placement:

•

Use a vacuum pick up hand tool with soft tip head.

•

If vacuum pick up tool is not available, use non-metal tweezers and hold the part by the inductor body side

terminals rather than the micro SMD die on top.

•

Use minimal force when picking and placing the module on the board.

•

In case a heat gun is required for rework, make sure that the heat source is pointing at the interface between

the inductor and the PCB. Do not apply heat gun directly on top of the component since it may affect the

solder joint between the micro SMD and the inductor. Using hot air station provides better temperature control

and better controlled air flow than a heat gun.

•

Go to the video section at www.ti.com/product/lmz10501 for a quick video on how to solder rework the

LMZ10501.

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